China Abrasive wheel (KINIK) (1560) reflected rapidly the market demand and creative effort, and will show the latest patent technology of Eletroplated Diamond Wire in 2012 SEMICON Exposition to resolve effectively the cutting slices problem of high hardness sapphire substrate, the critical material in the upstream of LED. It is estimated that it will meet more than half market demand of Taiwan in 2013.

Sapphire is still the critical materials used in the upstream of LED. Sapphire demand is turned to the large size as the increasing demand of high power LED. There all used the fixed abrasive particles of Eletroplated Diamond Wire to process multi-thread saw wire in the slices process because of the high hardness feature of the Sapphire material.

Muti-thread wire saw cutting is processing method for the semi-conductor, berg crystal, all kinds of single crystal, precision ceramics and other hard and brittle materials. Free abrasives wire saw is widely used manufacturing process of semi-conductor and solar energy silicon wafer slices to remove the materials through steel wire driving free abrasives (abrasives+liquid). But there has the environmental problem on abrasives wastes after free abrasives wire saw used and low processing efficiency, so it is the trend to develop the fixed abrasive particles wire saw for the industry.