Back thinning, rough grinding and fine grinding of silicon wafer.
Workpiece processed include silicon wafer of discrete devices, integrated chips (IC) and virgin etc.
Advantages of back grinding wheels
Good Self-dressing ability, Long life and low prices.
High heat conductivity, high wear resistance, and low coefficient.
It is highly desirable that grinding wheels generate only very low damage to ground wafers.
Applicable grinding machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
Contact Detail:
Address:
No.171 Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
