* Excellent cutting ability that help reduce chipping, fractures and achive smooth surface finish
* Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc
* Able to precisely control diamond concentration to achieve cutting quality
* Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3?m to 250?m depending on blade thickness
Applications of resin bond dicing blade
