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Home -- Products -- Silicon grinding wheels/Silicon Wafer Back Grinding Wheels

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Silicon grinding wheels/Silicon Wafer Back Grinding Wheels
 

 
Product Name: Silicon grinding wheels/Silicon Wafer Back Grinding Wheels
Trade Mark:
Model:
Place of Origin: China(Mainland)
Price Terms:
Payment Terms:
Packing: carton/wooden
Delivery Lead Time: 12 work days
Minimum Order: 10
Certification:
Detailed Description:
Application:
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

Advantages:
1.High efficiency
2.High precision
3.Easy processing

  Contact Detail:
Address: No.171 Zhongyuan Rd, Zhongyuan District, Zhengzhou, 450001, Henan, China
Postcode: 450001
Telephone: 86-371-86545906
Fax: 86-371-86545906
Website: www.moresuperhard.com
Marketing man : Zoe Chen
Phone/Mobile: 86-18695876475
Email: zoe@moresuperhard.com

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Superhard Material of China

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Abrasives and Grinding Products of China

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Coated Abrasives of China

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China International Abrasives & Grinding Exposition

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