Silicon grinding wheels/Silicon Wafer Back Grinding Wheels
Product Name: Silicon grinding wheels/Silicon Wafer Back Grinding Wheels
Trade Mark:
Model:
Place of Origin: China(Mainland)
Price Terms:
Payment Terms:
Packing: carton/wooden
Delivery Lead Time: 12 work days
Minimum Order: 10
Certification:
Detailed Description:
Application:
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.